Building next-generation interconnect fabric for AI and high-performance computing — from silicon to system.
We are building the foundational interconnect technology that will power the next era of AI infrastructure — enabling unprecedented scale, bandwidth, and efficiency across heterogeneous compute.
Pioneering chiplet integration and advanced packaging technologies that break through the limits of monolithic silicon design.
Ultra-low-latency, high-bandwidth interconnect fabric designed from the ground up for the demands of modern AI workloads.
Architecture designed to scale seamlessly from rack-level clusters to data-center-wide deployments without compromising performance.
Our multi-disciplinary approach spans silicon, optics, packaging, and system architecture to deliver a complete interconnect solution.
Standards-based die-to-die interfaces enabling heterogeneous chiplet integration with industry-leading bandwidth density and energy efficiency.
Tight integration of photonic engines with compute silicon, delivering terabit-scale bandwidth with dramatically reduced power consumption.
2.5D and 3D packaging technologies combining logic, memory, and interconnect into tightly integrated multi-die systems.
Proprietary network-on-chip and fabric IP designed for coherent, low-latency communication across disaggregated AI compute clusters.
Seasoned leaders from the semiconductor and AI infrastructure industry, united by a shared vision for the future of compute.
20+ years in semiconductor leadership, previously driving interconnect strategy at major silicon companies. Deep expertise in scaling hardware businesses from inception to volume.
Former principal engineer at leading chipmakers with 50+ patents in high-speed interconnect and packaging. Recognized expert in die-to-die communication and optical integration.
Extensive track record building and shipping complex silicon products. Led multi-hundred-person engineering teams delivering cutting-edge networking and compute ASICs.
We're selectively engaging with strategic partners, investors, and exceptional talent. Reach out to start a conversation.
Whether you're an investor exploring the AI infrastructure space, a potential partner in the semiconductor ecosystem, or an engineer passionate about pushing the boundaries of interconnect technology — we'd love to hear from you.
hello@exafabric.ai